Other Device Processing Tools

Critical Point Dryer

Critical Point Dryer

SPI-DRY™
Standard Operating Procedure

Description:

Low Temperature Isotropic Etcher

Features:

13.56 MHz RF Generator 500 W max
Quartz process chamber 10″ dia. x 20″ deep
Supported Gasses: CF4 & O2
Base Pressure: 60 mTorr


Rapid Thermal Annealer

Rapid Thermal Annealer

VWR(R) Standard

Description:

N/A

Features:

Max temperature: 1200 °C
Manual and Auto2, H2


Tube Furnace

Tube Furnace

Lindeburg Tube Furnace

Description:

N/A

Features:

Maximum Temperature: 1200 °C


3 Zone Tube Furnace

3 Zone Tube Furnace

Lindeburg 3″ 3 Zone Tube Furnace

Description:

N/A

Features:

3 ft x 3″ diameter tube
3 heating zones
Maxumum Temperature: 1500 °C


Wafer Scriber

Karl Suss Wafer Scriber

Karl Suss Wafer Scriber

Description:

N/A

Features:

N/A